Polyimide cure device (300mm wafer compatible clean bake device)
300mm wafer-compatible polyimide cure, baking, low-temperature annealing, compatible with multilayer substrates. Thermal processing equipment for mass production of advanced electronic devices.
High uniformity hot air heating in a low oxygen atmosphere (N2) after vacuum replacement. Heating treatment of 300mm wafers in cassette units. Compatible with system LSI polyimide curing and flexible printed circuit board curing/annealing. Achieving both high quality and mass production with curing of 300mm wafer cassette units.
- Company：神港精機 東京支店
- Price：Other
